According to the latest report by Gartner® titled "AI Vendor Race: Infineon Becomes the Leading Company in AI Data Center Power Semiconductors" (AI 

Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors), Gartner conducted a study on the rapidly growing AI data center 

power semiconductor market and selected Infineon Technologies AG (FSE code: IFX / OTCQX code: IFNNY) as the "most competitive company" in this field. 

Gartner pointed out in the report that Infineon's ability to achieve this position lies in its "complete product portfolio, manufacturing capabilities, and early 

investment in advanced technologies". The report also noted that Infineon's leading position is facing competition from the SiC and GaN fields as well as 

from rivals in the computing motherboard sector; Infineon is also actively responding to these challenges through its extensive product line and technical 

expertise at the system level.

Gartner believes that Infineon's role in promoting the 800 VDC power architecture for AI data centers is a key factor in enabling it to become an industry 

leader.

As the breadth of the product portfolio and system-level technical expertise increasingly become key competitive advantages for AI data center operators 

in achieving sustainable scale-up, Infineon estimates that its AI market revenue will reach 2.5 billion euros in the fiscal year 2027. This growth expectation is

 mainly due to Infineon's leading product portfolio covering the entire power supply chain for AI data centers.

Widely diversified product portfolio covering the entire power supply chain

Gartner's comment states that Infineon has consolidated its position in the AI data center semiconductor market through its "grid-to-core" solutions 

covering the entire power supply architecture, strategically addressing the unprecedented power density and heat management bottlenecks caused by 

high-efficiency AI workloads. When many competitors only provide solutions for a specific stage of the data center power supply chain, Infineon offers 

optimized semiconductor solutions at each conversion stage - from solid-state transformers (SST), power supply units (PSU), energy storage systems (ESS), 

to intermediate bus converters (IBC) and processor-end power management - ensuring the maximum efficiency, reliability, and performance of the entire 

system.

By optimizing each stage of the power supply chain with the most suitable semiconductor technology, Infineon helps data center operators reduce energy 

losses across multiple power conversion stages, which is a key advantage for ultra-large-scale data centers and contributes to the overall sustainable goals 

of the industry.

SiC and GaN: Applying the Most Appropriate Technology at Each Stage

Infineon's strategic layout in semiconductor material strategy has created its extensive product portfolio. Gartner pointed out that Infineon's strategic and 

early investment in wide bandgap (WBG) semiconductors (including SiC and GaN) have brought key advantages in providing high-efficiency power 

solutions, especially for the next-generation 800 VDC AI data center field. By seamlessly integrating advanced WBG materials - SiC for high-efficiency, high-

voltage power conversion from the grid to the cabinet; GaN for extremely high-density, high-frequency intermediate power stages - with traditional silicon 

(Si) technology still used in the processor end, Infineon can minimize energy losses at each power conversion stage.

From empowering AI data centers to the implementation of physical AI

Infineon continues to expand its partnerships in the AI value chain, collaborating closely with system integrators, data center operators, and technology 

leaders to accelerate the development of the next-generation power architecture.

Beyond the data center sector, Infineon's advanced semiconductor solutions have also made "physical AI" a reality, enabling perception, thinking, and 

action for humanoid robots, collaborative machines, and autonomous systems, while also ensuring functional safety and information security. With 

expertise spanning microcontrollers, power systems, sensing, connectivity, functional safety, and information security, Infineon has become a comprehensive 

and reliable partner for the physical AI platform. According to UBS Research (2025), the global robot market size will reach 1.7 trillion US dollars by 2050, 

with 300 million humanoid robots deployed, and the estimated semiconductor BOM (bill of materials) for each humanoid robot is approximately 500 US 

dollars. This indicates that physical AI is one of the most significant growth opportunities in the coming decades. From the public power grid to processor 

cores, from data centers to factory workshops, Infineon empowers the all-round development of the AI era.