[March 31, 2026, Munich, Germany] Infineon Technologies AG (FSE code: IFX / OTCQX code: IFNNY), a global leader in semiconductors for power systems and the Internet of Things, has launched two new high-voltage intermediate bus converters (HV IBC) reference designs to help customers accelerate the transition to ±400 V and 800 V direct current (VDC) power supplies for AI server power architectures. These reference designs utilize Infineon's 650 V CoolGaN™ switches, specifically designed for ultra-large-scale cloud service providers, power architecture providers, and server OEMs that seek higher rack power, lower distribution losses, and better heat dissipation performance. 

Infineon's high-voltage intermediate bus converter (HV IBC) reference design can help customers accelerate the transition to ±400 V and 800 V DC (VDC) power supply architectures for AI server power systems. 

The new reference design is developed for two different architectures: the 800 VDC to 50 V design serves as the intermediate stage for the downstream 48 V IBC module, while the 800 VDC to 12 V design provides direct voltage conversion for compact server motherboards. For customized applications, Infineon also offers the digital controller XDPP1188-200C, which supports flexible output voltages including 48V, 24V, and 12V. 

Christian Burrer, Vice President of the Power Systems Division at Infineon Technologies, stated: "Infineon is consistently at the forefront of AI power supply technology. Our HV IBC reference design, leveraging high-quality power semiconductors and system-level design expertise, helps customers accelerate their journey towards high-voltage direct current data center architectures. By showcasing a complete and efficient implementation solution, we assist customers in reducing development risks, enhancing power density, and achieving significant energy efficiency improvements on a large scale." 

The 800 VDC or ±400 V to 50 V HV IBC reference design launched this time is specifically developed for the next-generation AI data centers, with a load efficiency exceeding 98%. This design employs Infineon's optimized high-voltage and medium-voltage CoolGaN™ switches, EiceDRIVER™ gate drivers, and PSOC™ microcontrollers. It includes two 3 kW 400 V to 50 V conversion modules, configured in an input series-output parallel (ISOP) configuration. This architecture can be expanded to a 6 kW continuous power design (TDP) and supports reaching 10.8 kW within 400 µs. By using PCB-integrated planar transformers, multi-level synchronous rectifiers, and soft switching under full load conditions, electromagnetic interference (EMI) is reduced. This compact design has a size of only 60 x 60 x 11 mm, achieving an excellent power density of 2.5 kW/in³. 

The second reference design is a ultra-thin HV IBC demonstration board that directly converts the 800 VDC bus voltage into a 12 V intermediate bus voltage. This design provides a 6 kW TDP and supports a peak power of 10.8 kW within 400 µs. As an ISOP half-bridge LLC converter, it adopts an innovative matrix transformer design, with a board area of 130 mm × 40 mm and a thickness of only 8 mm. Its power density exceeds 2.3 kW/in³ and supports an innovative server motherboard cooling solution. The peak efficiency can reach 98.2%, and the full-load efficiency can reach 97.1%. To meet these stringent specification requirements, this design uses Infineon's efficient 650 V CoolGaN™ and 40 V OptiMOS™ 7 switches, along with EiceDRIVER™ gate drivers and PSOC™ microcontrollers. 

These two HV IBC reference designs have been optimally designed to work in conjunction with Infineon's various AI server power supply products from the grid to the core, including solid-state transformers and solid-state circuit breakers, high-voltage and intermediate bus conversion, and second-level DC conversion power modules. Infineon fully leverages the advantages of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to significantly enhance product efficiency, density, and reliability. With verified high-quality semiconductor components, continuous design support, and scalable product performance, Infineon provides customers with a clear path to the end-to-end power architecture for the next-generation AI server platform.