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Infineon has launched the OptiMOS 8 100V power MOSFET, which is suitable for motor drive and battery protection applications.

The major trends such as green transportation, robots, and artificial intelligence have placed increasingly stringent demands on the reliability of power systems in handling load currents. To address these challenges, Infineon Technologies AG (FSE code: IFX / OTCQX code: IFNNY), a global semiconductor leader in power systems and the Internet of Things, has introduced the OptiMOS™ 8 100V power MOSFET technology, which has been specifically optimized for applications such as motor control and battery protection, with RDS(on) as the key metric. 

Infineon has launched the OptiMOS™ 8 100V power MOSFET technology, which has been specifically optimized for applications such as motor control and battery protection. 

Compared with the previous generation product OptiMOS™ 5, the new OptiMOS™ 8 has achieved significant improvements in both cost performance and ease of use. The RDS(on) reduction can reach up to 44%. This product has the highest peak current output capability in motor drive inverter applications, with an increase of up to 18%. It has set a new industry benchmark. For static switch applications such as battery protection in battery management systems (BMS), the optimization of RDS(on) can achieve higher power density, fewer components, and further improved thermal performance. 

As the power scale of AI data centers continues to increase, the power density requirements for battery backup units (BBUs) are also constantly rising. The OptiMOS™ 8 100V can meet the highest power density requirements of large-power BBU systems, precisely aligning with this trend. 

The OptiMOS™ 8 100V has a strict ΔVGS(th) specification of less than 0.8V, and is combined with low transconductance (gfs) characteristics, enabling the best current sharing effect and enhancing system reliability. To cover a wide range of application scenarios, the OptiMOS™ 8 series offers a variety of package options, including packaging solutions using the clip technology, such as the TOLL package with copper clips, and the mature SuperSO8 5x6 package. Both types of packaging can achieve better thermal performance. 

Infineon's recently launched reference design has been verified in actual application scenarios regarding the performance of these products. This reference board combines OptiMOS™ 8 100V with XENSIV™ TMR current sensor and PSOC™ Control C3 microcontroller to achieve field-oriented control (FOC) for battery-powered low-altitude logistics applications. It is an out-of-the-box solution for electronic speed controllers (ESC).