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Marvell will launch a 192.4 terabit per second switching chip and start delivering samples.

Marvell, a leading electronics company, will officially release a sample of its 3-nanometer process-based switching chip with a bandwidth of 102.4 terabits per second (Tbps) in the second quarter. 

In terms of its architecture design, this Teralynx T100 chip aims to achieve the lowest power consumption and the lowest latency at this bandwidth level. 

Currently, the power consumption of switching and network devices accounts for approximately 15% to 25% of the total power consumption of the entire cabinet. Therefore, low-power consumption switching chips have become a must-have in the industry. 

This chip can simplify the AI network hierarchy and optical links, helping to build a switching architecture with a flatter topology and a larger port base. It perfectly suits high-load artificial intelligence business scenarios. 

Large ports, high bandwidth, and low latency switches are the core hardware for enhancing GPU utilization, reducing long tail latency, and shortening the convergence time of training algorithms. The T100 chip has the advantage of bandwidth efficiency and can further reduce the power consumption of the entire cabinet and optimize the performance of the cluster operation. 

In the horizontal expansion deployment scenario, the T100 can support a maximum of 512 port specifications, helping the operation and maintenance personnel consolidate network layers and simplify the architecture, thereby reducing the end-to-end latency for large-scale AI training clusters composed of tens of thousands of acceleration cards. 

For the vertical expansion scenario, the pipeline architecture of this chip is compatible with various interconnection standards and the new internal interconnection protocols of the next-generation clusters, including the Ethernet Vertical Interconnection Protocol (ESUN), and also meets the latest technical specifications of the Ultra-Ethernet Consortium (UEC). 

This chip offers multiple packaging forms, including ball grid array (BGA), co-packaged copper wire (CPC), and co-packaged optical (CPO). 

The chip natively supports delay-optimized network topologies, integrated telemetry functions, AI-oriented congestion control mechanisms, as well as self-developed traffic management logic required for high-end data center architectures.