SMD4300LTLFP250T4

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Bi57.6Sn42Ag0.4 (57.6/42/0.4)

Diameter :

-

Flux Type :

No-Clean

Form :

Jar, 8.8 oz (250g)

Melting Point :

280°F (138°C)

Mesh Type :

-

Process :

Leaded

Product Status :

Active

Shelf Life :

6 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

32°F ~ 77°F (0°C ~ 25°C)

Type :

Solder Paste

Wire Gauge :

-