RC9601031PSAC

Manufacturer :

Canfield Technologies

Product Category :

Solder

Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

Rosin Mildly Activated (RMA)

Form :

Spool, 1 lb (454 g)

Melting Point :

423 ~ 424°F (217 ~ 218°C)

Mesh Type :

-

Process :

Lead Free

Product Status :

Active

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Solder Paste

Wire Gauge :

-