NC191LTA50

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Bi57Sn42Ag1 (57/42/1)

Diameter :

-

Flux Type :

No-Clean

Form :

Jar, 1.76 oz (50g)

Melting Point :

279°F (137°C)

Mesh Type :

4

Process :

-

Product Status :

Active

Shelf Life :

12 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

37°F ~ 46°F (3°C ~ 8°C)

Type :

Solder Paste

Wire Gauge :

-