SMDIN97AG3

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

In97Ag3 (97/3)

Flux Type :

-

Form :

Spool

Melting Point :

289°F (143°C)

Mesh Type :

-

Process :

Lead Free

Product Status :

Active

Shelf Life :

24 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

-

Type :

Wire Solder

Wire Gauge :

20 AWG, 21 SWG