TS391SNL10

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

No-Clean

Form :

Syringe, 1.23 oz (35g), 10cc

Melting Point :

423 ~ 428°F (217 ~ 220°C)

Mesh Type :

4

Process :

Lead Free

Product Status :

Active

Shelf Life :

12 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

68°F ~ 77°F (20°C ~ 25°C)

Type :

Solder Paste

Wire Gauge :

-