NC4SW.031 1LB

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Pb93.5Sn5Ag1.5 (93.5/5/1.5)

Flux Type :

No-Clean

Form :

Spool, 1 lb (454 g)

Melting Point :

565 ~ 574°F (296 ~ 301°C)

Mesh Type :

-

Process :

Leaded

Product Status :

Active

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Wire Solder

Wire Gauge :

20 AWG, 21 SWG