CQ100GE.020 1LB

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Sn99.244Cu0.7 (Ni0.05/Ge0.006)

Flux Type :

No-Clean

Form :

Spool, 1 lb (454 g)

Melting Point :

441°F (227°C)

Mesh Type :

-

Process :

Lead Free

Product Status :

Active

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Wire Solder

Wire Gauge :

-