EXB-SN96.5AG3.0CU0.5

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

-

Form :

Bar, 1 lb (454g)

Melting Point :

423 ~ 428°F (217 ~ 220°C)

Mesh Type :

-

Process :

Lead Free

Product Status :

Active

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Bar Solder

Wire Gauge :

-