TS991SNL500T4

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

No-Clean

Form :

Jar, 17.64 oz (500g)

Melting Point :

423°F (217°C)

Mesh Type :

4

Process :

Lead Free

Product Status :

Active

Shelf Life :

12 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

-

Type :

Solder Paste

Wire Gauge :

-