EXB-SN99.3CU0.7-0.5LB

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Sn99.3Cu0.7 (99.3/0.7)

Diameter :

-

Flux Type :

-

Form :

Bar, 0.5 lb (227g)

Melting Point :

441°F (227°C)

Mesh Type :

-

Process :

Leaded

Product Status :

Active

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Bar Solder

Wire Gauge :

-