BM23PF0.8-14DP-0.35V(895)

Manufacturer :

Hirose

Product Category :

Arrays, Edge Type, Mezzanine (Board to Board)

Connector Type :

Header, Outer Shroud Contacts

Contact Finish :

Gold

Contact Finish Thickness :

1.97µin (0.050µm)

Features :

Solder Retention

Mated Stacking Heights :

0.8mm

Mounting Type :

Surface Mount

Number of Positions :

14

Number of Rows :

2

Product Status :

Active