DILB8P-223TLF

Manufacturer :

Amphenol Communications Solutions

Product Category :

IC Sockets

Contact Finish - Mating :

Tin

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

100.0µin (2.54µm)

Contact Finish Thickness - Post :

100.0µin (2.54µm)

Contact Material - Mating :

Copper Alloy

Contact Material - Post :

Copper Alloy

Features :

Open Frame

Housing Material :

Polyamide (PA), Nylon

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

8 (2 x 4)

Operating Temperature :

-55°C ~ 105°C

Product Status :

Active

Termination :

Solder