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TC1-200G

Mfr.Part #
TC1-200G
Manufacturer
Chip Quik, Inc.
Package/Case
-
Datasheet
Download
Description
HEAT SINK COMPOUND - HIGH DENSIT
Stock
10

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Manufacturer :
Chip Quik, Inc.
Product Category :
Thermal - Adhesives, Epoxies, Greases, Pastes
Color :
White
Features :
-
Product Status :
Active
Shelf Life :
60 Months
Size / Dimension :
200 gram Jar
Storage/Refrigeration Temperature :
37°F ~ 77°F (3°C ~ 25°C)
Thermal Conductivity :
0.67W/m-K
Type :
Silicone Compound
Usable Temperature Range :
-
Datasheets
TC1-200G