APF19-19-13CB/A01

Manufacturer :

CTS Corporation

Product Category :

Thermal - Heat Sinks

Attachment Method :

Thermal Tape, Adhesive (Included)

Diameter :

-

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Power Dissipation @ Temperature Rise :

-

Product Status :

Active

Shape :

Square, Fins

Thermal Resistance @ Forced Air Flow :

4.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

-

Type :

Top Mount