HSB18-232310

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Adhesive

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

3.7W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

6.80°C/W @ 200 LFM

Thermal Resistance @ Natural :

20.41°C/W

Type :

Top Mount