V-1102-SMD/A-L

Manufacturer :

ASSMANN WSW Components

Product Category :

Thermal - Heat Sinks

Attachment Method :

SMD Pad

Diameter :

-

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D²Pak)

Power Dissipation @ Temperature Rise :

-

Product Status :

Active

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

23.00°C/W @ 300 LFM

Thermal Resistance @ Natural :

11.00°C/W

Type :

Top Mount