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HSE12-B20-NP

Mfr.Part #
HSE12-B20-NP
Manufacturer
CUI Devices
Package/Case
-
Datasheet
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Description
HEAT SINK, EXTRUSION, TO-218/TO-
Stock
2000

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
1.94W @ 75°C
Product Status :
Active
Shape :
Rectangular
Thermal Resistance @ Forced Air Flow :
19.20°C/W @ 200 LFM
Thermal Resistance @ Natural :
38.75°C/W
Type :
Top Mount
Datasheets
HSE12-B20-NP