HSS26-B20-P38

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Bolt On and PC Pin

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

TO-218, TO-220

Power Dissipation @ Temperature Rise :

4.5W @ 75°C

Product Status :

Active

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

9.20°C/W @ 200 LFM

Thermal Resistance @ Natural :

16.66°C/W

Type :

Board Level, Vertical