HSS07-C20-P274

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

PC Pin

Diameter :

-

Material :

Copper Alloy

Material Finish :

Tin

Package Cooled :

TO-220

Power Dissipation @ Temperature Rise :

2.5W @ 75°C

Product Status :

Active

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

12.60°C/W @ 200 LFM

Thermal Resistance @ Natural :

29.57°C/W

Type :

Board Level, Vertical