HSE01-193175P

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Thermal Tape, Adhesive (Included)

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Blue Anodized

Package Cooled :

-

Power Dissipation @ Temperature Rise :

2.95W @ 75°C

Product Status :

Active

Shape :

Square, Angled Fins

Thermal Resistance @ Forced Air Flow :

9.20°C/W @ 200 LFM

Thermal Resistance @ Natural :

25.44°C/W

Type :

Top Mount