HSE08-505028

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Clip

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

TO-218, TO-220

Power Dissipation @ Temperature Rise :

10.53W @ 75°C

Product Status :

Active

Shape :

Rectangular, Angled Fins

Thermal Resistance @ Forced Air Flow :

2.70°C/W @ 200 LFM

Thermal Resistance @ Natural :

7.13°C/W

Type :

Board Level