HSS13-B20-NP

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

-

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

TO-220

Power Dissipation @ Temperature Rise :

4.8W @ 75°C

Product Status :

Active

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

7.70°C/W @ 200 LFM

Thermal Resistance @ Natural :

15.50°C/W

Type :

Board Level, Vertical