HSB19-272718

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Adhesive

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

6.8W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

4.50°C/W @ 200 LFM

Thermal Resistance @ Natural :

11.11°C/W

Type :

Top Mount