HSS-C2540-SMT-TR

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

-

Diameter :

-

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D²Pak)

Power Dissipation @ Temperature Rise :

3.8W @ 75°C

Product Status :

Active

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

5.50°C/W @ 200 LFM

Thermal Resistance @ Natural :

21.90°C/W

Type :

Board Level