HSS-B20-NPR-01

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Bolt On

Diameter :

-

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

TO-220

Power Dissipation @ Temperature Rise :

4.2W @ 75°C

Product Status :

Active

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

5.88°C/W @ 200 LFM

Thermal Resistance @ Natural :

17.74°C/W

Type :

Board Level