HSS08-B18-CP

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

PC Pin

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

TO-218

Power Dissipation @ Temperature Rise :

10.3W @ 75°C

Product Status :

Active

Shape :

Square

Thermal Resistance @ Forced Air Flow :

3.50°C/W @ 200 LFM

Thermal Resistance @ Natural :

7.29°C/W

Type :

Board Level, Vertical