XL25-35-35-10-T1-0.25

Manufacturer :

T-Global Technology

Product Category :

Thermal - Heat Sinks

Attachment Method :

Thermal Tape, Adhesive (Included)

Diameter :

-

Material :

Ceramic

Material Finish :

-

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Power Dissipation @ Temperature Rise :

-

Product Status :

Obsolete

Shape :

Square

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Heat Spreader