833900T00000

Manufacturer :

Comair Rotron

Product Category :

Thermal - Heat Sinks

Attachment Method :

SMD Pad

Diameter :

-

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D²Pak)

Power Dissipation @ Temperature Rise :

2.0W @ 40°C

Product Status :

Obsolete

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

5.00°C/W @ 400 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level