PH3N-76.2-25.4-0.07-1A

Manufacturer :

T-Global Technology

Product Category :

Thermal - Heat Sinks

Attachment Method :

Adhesive

Diameter :

-

Material :

Copper

Material Finish :

Polyester

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Power Dissipation @ Temperature Rise :

-

Product Status :

Obsolete

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Heat Spreader