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TH997-288-192-1.0
- Mfr.Part #
- TH997-288-192-1.0
- Manufacturer
- Penchem Technologies Sdn Bhd
- Package/Case
- -
- Datasheet
- Download
- Description
- SOFT SILICONE THERMAL PAD
- Stock
- 17
- Manufacturer :
- Penchem Technologies Sdn Bhd
- Product Category :
- Thermal - Pads, Sheets
- Adhesive :
- Tacky - Both Sides
- Backing, Carrier :
- -
- Color :
- Blue
- Material :
- Silicone
- Outline :
- 288.00mm x 192.00mm
- Product Status :
- Active
- Shape :
- Rectangular
- Thermal Conductivity :
- 2.4W/m-K
- Thermal Resistivity :
- -
- Type :
- Gap Filler Pad, Sheet
- Usage :
- Thermally Conductive
- Datasheets
- TH997-288-192-1.0