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2026-04-17

The Microchip BZPACK silicon carbide power module is capable of withstanding the harsh conditions of the HV-H3TRB environment.

Microchip has officially launched the BZPACK mSiC silicon carbide power module. This series of products is specifically designed to meet the requirements of high humidity, high voltage, and high-temperature reverse bias (HV-H3TRB) standards, an...
2026-04-16

Molex accelerates the deployment of AI clusters through its one-stop optical interconnection architecture and its first-ever high-capacity optical circuit switching platform.

Molex has combined the VersaBeam EBO backplane connector with the Teramount TeraVERSE detachable optical fiber connector, enhancing maintainability and reducing deployment time by 85%.The enhanced CPO kit with universal format interconnection ...
2026-04-15

Vishay's dual-channel Wilkinson power divider/suppressor enhances efficiency and saves space in high-frequency connection applications.

Recently, Vishay Intertechnology, Inc. (NYSE stock symbol: VSH) announced the launch of a new dual-channel Wilkinson power divider/synthesizer - WLKN-000, aiming to enhance efficiency and save space in aerospace and high-frequency connection ap...
2026-04-14

Siemens collaborates with NVIDIA to accelerate AI chip verification to the trillion-cycle level

Siemens and NVIDIA have achieved a key breakthrough in the verification field. By deeply integrating Siemens Veloce proFPGA CS system with NVIDIA's performance-optimized chip architecture, they can complete the verification collection...
2026-04-13

New Product | Infineon XHP 2 Series 2300V CoolSiC Silicon Carbide MOSFET

Infineon XHP™ 2 series at 2300V with CoolSiC™ technologySilicon carbide MOSFETTo meet the growing demand for 1500V DC bus applications in the renewable energy sector, Infineon has launched the XHP™ 2 series of 2300VCoolSiC™ MOS...
2026-04-12

Murata has begun mass production of 7 types of automotive MLCCs, achieving classification by rated voltage and size with extremely large electrostatic capacity.

MURATA Corporation (hereinafter referred to as "Murata") has initiated the mass production of 7 new products in the field of multi-layer ceramic capacitors (MLCC) for automobiles. These products are classified based on their rated voltage and size...
2026-04-11

TDK has launched ultra-small noise suppression filters for audio circuits

TDK has launched ultra-small noise suppression filters for audio circuits, achieving high noise attenuation in the 5GHz frequency band.This filter achieves industry-leading noise attenuation in the high-frequency range above 5GHz.The newly developed l...
2026-04-10

NXP has launched the Omlox Starter Kit for industrial RTLS deployments.

NXP Semiconductors has officially launched the Omlox Starter Kit, aiming to simplify the deployment of real-time location systems (RTLS) in industrial scenarios. This kit is based on the Omlox open standard and integrates hardware, software and an...
2026-04-09

ROHM has launched ESD protection diodes that support high-speed I/Fs of 10Gbps and above.

The globally renowned semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) announced today the launch of the ESD (electrostatic discharge) protection diode series "RESDxVx" featuring industry-leading ultra-low dynamic resistance (Rdy...
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